Intel & Micron Sign New 3D XPoint Wafer Supply Agreement

in People/technology

Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as it is now the only maker of 3D XPoint. The new pact also shows that Intel wants to continue making products based on 3D XPoint, but details about the products remain to be seen.

Having ended its NAND and 3D XPoint partnerships with Micron, Intel sold its former partner its stake in their mutually owned fab in Lehi, Utah. Since the company yet has to move production of 3D XPoint memory used for its Optane-branded products to its Fab 68 in Dalian, China, the chipmaker had to sign a supply agreement with Micron, under which the latter would sell the memory to its former ally at pre-agreed prices for one year after it gains ownership of the fab.

Micron gained ownership back in October, which is when the agreement came into effect. As it turns out, the two companies terminated the deal on March 9 and signed a new one ‘with changes to pricing and forecast terms’. The companies did not reveal additional details, but Micron said that the deal was ‘not material to Micron and does not change Micron’s previously-communicated outlook’.

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